Custom Power Amplifiers

Falcomm designs custom RF and mmWave power-amplifier ICs, from architecture through in-house prototype assembly and lab measurement. Each design is developed around the operating band, thermal environment, and integration requirements of the system.

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Illustrative PA die, test fixture, and production tray

Explore the process

Requirements consultation

We start with the operating band and bandwidth, output-power and linearity targets, thermal and test conditions, and packaging or integration constraints. These inputs inform the architecture, package selection, and simulation setup.

IC and package simulation

Falcomm pairs RF/mmWave IC design with 3D electromagnetic package simulation to examine die, package, and integration behavior before hardware is built.

In-house prototype test

Falcomm assembles and tests prototypes in-house. The lab measures from DC to 150 GHz, including CW, small-signal, modulation, and VSWR testing to characterize device performance.

Partner fabrication and packaging

U.S. foundry partners fabricate wafers, and OSAT (outsourced semiconductor assembly and test) partners support dicing and packaging. Falcomm coordinates production and qualification support across these partners.

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Tell us what you need to build.

Share the known requirements below, including operating band and bandwidth, thermal and test conditions, and package or integration needs. If a field is still open, say so, and Falcomm's RF team will review the application and test approach with you.

Email: info@myfalcomm.com
Design scope: Custom RF/mmWave PA design
Test range: DC–150 GHz lab measurement

From requirements through production and qualification support

Each program follows an engineering path scoped to its technical and manufacturing requirements. Qualification support is available when required, but qualification outcomes depend on the program and its test plan.

Macro of a custom Falcomm RF board with a bare die wire-bonded at its center

01 · Define requirements

Define the operating band and bandwidth, output power, efficiency and linearity targets, thermal and test conditions, package or integration needs, qualification environment, and quantity.

Micrograph of a Falcomm bare power amplifier die with the Falcomm mark on the top metal

02 · Architect and simulate

Falcomm scopes the PA architecture and runs RF/mmWave circuit, PCB, and 3D electromagnetic package simulation before committing to silicon.

Wafer probe station in Falcomm's RF measurement lab

03 · Fabricate and test

Foundry partners fabricate the wafer. Falcomm assembles and measures prototypes in-house using the test approach selected for the device and its fixture.

Laser-marked Falcomm QFN packages, some flipped to show the exposed pad and lead frame

04 · Qualify and scale

Falcomm works with OSAT partners on dicing and packaging and can support production planning, Mil-Spec up-screening, and space-qualification activities where applicable.